Mini-LED 光学检测机(Optical Inspector)解决超微晶片不足0.1毫米，体积小、布局密，质检难度极高的难题；该设备采用高分辨率相机和AI增强算法，能够准确检测出偏移、锡膏、亮度、缺焊等10多种缺陷特征；同时进行外观检测与点亮检测，漏检率小于0.1%，检测精度优于5um，检测速度2000mm²/秒。
可检测最小3*5mil芯片 / Can detect 3*5 mil chips.
支持单板超10万颗芯片 / Supports single-board over 100,000 chips.
炉前炉后外观检测 / Pre-bake and post-bake opticalinspection.
少件、偏位、固翻、异物、旋转、重叠、立碑、浮高、缺件、多件
Missing part, misalignment, flipped components, foreign objects, rotation, overlap, tombstoning, lifted components, multiple components.
检测阵列自动生成，自动修正。多点测高，自动补偿高度差
Automated generation and correction of detection arrays. Multi-point height measurement with automatic compensation for height differences.
专利光源配合高分辨率镜头，捕捉超微缺陷
Patented light source combined with high-resolution lenses to capture ultra-fine defects.
解决超微晶片不足0.1毫米，体积小、布局密，质检难度极高的难题。
Solving the challenge of inspecting ultra-small chips, less than 0.1 miimeters in size, with small volume and dense layout, presents an extremely high difficulty in quality inspection.
采用高分辨率相机和AI增强算法，能够准确检测出偏移、锡膏、亮度、缺焊等10多种缺陷特征。
By employing high-resolution cameras and Al-enhanced algorithms, the system can accurately detect over 10 types of defect features including misalignment, solder paste. brightness, and solder voids.
同时进行外观检测与点亮检测，漏检率小于0.1%，检测精度优于5um，检测速度2000mm²/秒。
Simultaneous appearance and illumination inspection, with a false negative rate of less than 0.1%, detection accuracy better than 5um, achieving a detection speed of 2000 mm²/second.
